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Kester 186 Flux Pens
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Kester 186 Flux Pens are specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Although their fluxing ab
Kester 186 Flux Pens are specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Although their fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive.
Kester 186 fluxes have been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubilit
Kester 186 fluxes have been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubilit
Kester 186 Flux Pens are specifically designed for leaded and lead-free rework of conventional and surface mount circuit board assemblies. Although their fluxing ability approaches that of Type RA flux, residues after soldering are non-corrosive and non-conductive.
Kester 186 fluxes have been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents.
There is no surface insulation-resistance degradation caused by flux residue. The use of a minimum of ionic activating agents and the inactive nature permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.
Flux pens are an easy and effective way to apply solder flux. Contact DX Engineering to get your Kester 186 Flux Pens… today!
Kester 186 fluxes have been developed for use in critical applications where difficult assemblies are to be soldered, but process requirements stipulate use of Type RMA flux. Kester 186 possesses high thermal stability for soldering multi-layer assemblies which require higher temperatures. Exposure to high preheat temperatures does not degrade solubility of the residue in normal cleaning solvents.
There is no surface insulation-resistance degradation caused by flux residue. The use of a minimum of ionic activating agents and the inactive nature permits leaving the residue on circuit board assemblies for many applications. The flux residue is also moisture and fungus resistant.
Flux pens are an easy and effective way to apply solder flux. Contact DX Engineering to get your Kester 186 Flux Pens… today!
Flux-Pen, "186" Mildly Activated Rosin, No-Clean, .33 oz., Each
Part Number: KTR-83-1000-0186
Cannot be shipped Internationally
Cannot be shipped Internationally